Apple has signed a multiyear agreement worth more than $30bn with Broadcom to design and manufacture over 15 billion custom wireless connectivity chips in the United States for future Apple devices.
As part of the partnership, Apple will invest $1.5bn in capital expenditure to help expand Broadcom’s semiconductor manufacturing facility in Fort Collins, Colorado, strengthening domestic chip production capabilities.
The agreement builds on Apple’s long-standing relationship with Broadcom, which currently serves as the company’s primary supplier of wireless connectivity components for products including the iPhone.
The investment also forms part of Apple’s broader commitment to invest $600bn in the U.S. economy over the next four years, following increased political pressure to expand domestic manufacturing and strengthen the country’s technology supply chain.
The commitment follows calls from the Trump administration for Apple to shift more of its manufacturing operations to the United States, although final iPhone assembly continues to take place overseas.
Apple said the expanded partnership with Broadcom is expected to create hundreds of new American jobs while supporting long-term investment in advanced semiconductor manufacturing across the United States.
